1design:There are bright spots in the subdivisions, and the design capabilities in the core key areas are insufficient。From application categories (such as mobile phones to automobiles) to chip projects (such as processors to FPGAs), the self-sufficiency rate of high-end key chips in China is almost zero, and it is still highly dependent on American companies;

2equipment：The self-sufficiency rate is low and the demand gap is large. Currently, breakthroughs are achieved in mid-end equipment, and the initial industrial chain layout is complete, but high-end processes/products still need to be overcome。Chinese local semiconductor equipment manufacturers only account for 1-2% of the global share, and they still rely heavily on American companies in key areas such as deposition, etching, ion implantation, and inspection;

3Material：It has reached the international level in the field of target materials, but it still takes a long time to realize domestic substitution in high-end fields such as photoresist.。The global semiconductor materials market is worth 44.3 billion U.S. dollars. The supply of wafer manufacturing materials to China accounts for less than 10%, and the supply of some packaging materials accounts for more than 30%. Leading internationally in some subdivisions, and no breakthrough has been achieved in high-end areas;