1: Higher accuracy ---±10μm/±0.2°@3σ.
2: More intelligent---automatic detection of base island, glue point, before and after solidification, and both sides of the chip.
3: Higher efficiency---UPH up to 3K/H.
4: Wafer---12 "compatible with 8".
5: Mapping---support single bin and multiple bins, automatic memory reference point, automatic search starting point
6: LF---width 35 ~ 100mm, length 180 ~ 300mm, thickness 0.1-3.0mm.
7: Data statistics---production information, statistical information, CPK analysis.