矽谷·国际智能装备解决方案供应商用细致的全方位服务,共同开启可持续发展得明天。

1: Higher accuracy ---±10μm/±0.2°@3σ.

2: More intelligent---automatic detection of base island, glue point, before and after solidification, and both sides of the chip.

3: Higher efficiency---UPH up to 3K/H.

4: Wafer---12 "compatible with 8".

5: Mapping---support single bin and multiple bins, automatic memory reference point, automatic search starting point

6: LF---width 35 ~ 100mm, length 180 ~ 300mm, thickness 0.1-3.0mm.

7: Data statistics---production information, statistical information, CPK analysis.