矽谷·国际智能装备解决方案供应商用细致的全方位服务,共同开启可持续发展得明天。

1: Heating function---multi-temperature zone control, up to 200°C.

2: More intelligent---automatic detection of base island, glue point, before and after curing.

3: Faster---UPH up to 18K/H.

4: Wafer---8 "compatible with 6",.

5: LF---width 28~100mm, length 180~300mm, thickness 0.1~1.0mm.

6: Loading---The material box and the material are compatible.

7: Mapping---support single bin and multiple bins, automatic memory reference point, automatic search starting point

8: Data statistics---production information, statistical information, operation log.