1: Wider---substrate 510*410.
2: More accurate---±20μm@3σ (based on 200*200um chip CPK≥1.33).
3: Faster---UPH 18K/H.
4: Smarter-automatic detection of pads, glue dots, before and after solidification.
5: Wafer---6 "compatible with 4". .
6: Mapping---support single bin and multiple bins, automatic memory reference point, automatic search starting point
7: Data statistics---production information, statistical information, CPK analysis.