矽谷·国际智能装备解决方案供应商用细致的全方位服务,共同开启可持续发展得明天。

1: Wider---substrate 510*410.

2: More accurate---±20μm@3σ (based on 200*200um chip CPK≥1.33).

3: Faster---UPH 18K/H.

4: Smarter-automatic detection of pads, glue dots, before and after solidification.

5: Wafer---6 "compatible with 4". .

6: Mapping---support single bin and multiple bins, automatic memory reference point, automatic search starting point

7: Data statistics---production information, statistical information, CPK analysis.