矽谷·国际智能装备解决方案供应商用细致的全方位服务,共同开启可持续发展得明天。

1: More efficient---UPH up to 21K/H (based on 500*500um chips).

2: More intelligent---automatic detection of base island, glue point, before and after curing.

3: Faster---Quick model change, no need to replace the pallet, pressure plate, or track.

4: Wafer---12 "compatible with 8".

5: LF---length 180~300mm, width 28~100mm, thickness 0.1~1.0mm.

6: Feeding---The material box and the material are compatible.

7: Mapping---support single bin and multiple bins, automatic memory reference point, automatic search starting point

8: Data statistics---production information, statistical information.